New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI

New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI
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Researchers from The University of Tokyo create a new integrated 3D-circuit architecture for AI applications with spiraling stacks of memory modules, which may help lead to specialized machine-learning hardware that uses much less electricity. Credit: Institute of Industrial Science, The University of Tokyo Researchers from the Institute of Industrial Science at The University of Tokyo designed and built specialized computer hardware consisting of stacks of memory modules arranged in a 3D-spiral for artificial intelligence (AI) applications. This research may open the way for the next generation of energy-efficient AI devices. Machine learning is a type of AI that allows […]

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