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New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI

New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI

See the original article here: New Integrated 3D-Circuit Architecture With Spiraling Memory for More Efficient AI Researchers from The University of Tokyo create a new integrated 3D-circuit architecture for AI applications with spiraling stacks of memory modules, which may help lead to specialized machine-learning hardware that uses much less electricity. Credit: Institute of Industrial Science, The University of Tokyo Researchers

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